Diamond Seeds and Substrates

Larger, harder, serving a broader range of applications

• Greater hardness and toughness than natural or HPHT diamond
• Planar substrates with high purity, inclusion free and sector free
• Single-crystal diamonds up to 10mm square
• Mosaic-process diamonds up to 28mm square
• Thickness from 0.01 to 2.5mm, ultra-thin available to less than 50µm
• (110) and (111) plates for tools and electronics
• Laser-cut custom shapes: circles, squares, rectangles, triangles, etc.
• Single- or double-sided polishing available to Ra >5nm
• Ideal thermal diffusion coefficient to protect devices from generated heat