New type electronic equipment being evolved continuously. The SMT supporting such evolution is required to advance in precision, efficiency and integration. YAMAHA copes with further progress by offering series of "Next generation intelligent modular: YS series" which has been newly developed and provides "JUST FIT SOLUTION" which has achieved satisfactory results and enjoyed the confidence of users.
YSi-V
Inspection Method: 2D＋3D＋4-way angular camera (option)＋laser
Resolution (options) : 12μm or 7μm
Purpose: Mounted Substrate inspection (AOI)
