1826MK5
Reflow Oven
Key Features
- Nitrogen/air lead-free reflow soldering system
- Enhanced heating module and fastest cooling ramp
- Save energy and nitrogen
- Simple maintenance design
- Temperature curve in one step
- Built-in ECD-CPK process monitoring tool
- Optional dual-track design to maximize production capacity
Specifications
Number of heating zones | Above: 8 / Below: 8 |
Number of cooling zones | Above: 2 |
substrate width | 50-610mm |
maximum transfer speed | 188cm/min |
Lateral temperature difference | +2°C |
Temperature control accuracy | ‡0.1°C |
Transmission track adjustment method | Motor driven, manual control |
operating system | Windows 7 |
Equipment size | W4650 × D1370 × H1600 mm |
weight | About 2060 kg |