1826MK5
1826MK5
1826MK5

1826MK5

Reflow Oven

Key Features

  • Nitrogen/air lead-free reflow soldering system
  • Enhanced heating module and fastest cooling ramp
  • Save energy and nitrogen
  • Simple maintenance design
  • Temperature curve in one step
  • Built-in ECD-CPK process monitoring tool
  • Optional dual-track design to maximize production capacity

Specifications

Number of heating zones

Above: 8 / Below: 8

Number of cooling zones

Above: 2

substrate width

50-610mm

maximum transfer speed

188cm/min

Lateral temperature difference

+2°C

Temperature control accuracy

‡0.1°C

Transmission track adjustment method

Motor driven, manual control

operating system

Windows 7

Equipment size

W4650 × D1370 × H1600 mm

weight

About 2060 kg

Other Brand Series

Contact
Us