1718MK5
1718MK5
1718MK5

1718MK5

Reflow Oven

Key Features

  • Nitrogen/air lead-free reflow soldering system
  • Enhanced heating module and fastest cooling ramp
  • Save energy and nitrogen
  • Simple maintenance design
  • Temperature curve in one step
  • Built-in ECD-CPK process monitoring tool
  • Optional dual-track design to maximize production capacity

Specifications

Number of heating zones

Above: 6 / Below: 6

Number of cooling zones

Above: 1

 

substrate width

 

 

50-610 mm

 

maximum transfer speed

188cm/min

Lateral temperature difference

+2°C

Temperature control accuracy

‡ 0.1°C

Track adjustment method

Motor driven, manual control

operating system

Windows 7

Equipment size

W 3 3 0 0 × D 1 3 7 0 × H 1 6 0 0 mm

equipment weight

About 1650kg

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