YSM20R(PV)

YSM20R(PV)

YSM20R(PV)
YSM20R(PV)

YSM20R(PV)

High efficiency modular placement machine

Key Features

  • Single-head solution: Flexible and high-speed, both small components and large wafers can be processed without changing heads, and the production line combination is suitable for both long and short lengths.
  • Ultra-high-speed placement capability: 95,000 CPH (Note: Tested under YAMAHA’s optimized conditions).
  • The flexible placement head can be optionally configured to meet customers' needs for high efficiency and low-cost production.
  • The touch screen mode makes operation more convenient and efficient.
  • The high-speed intelligent recognition function makes programming and component parameter setting faster.

Specifications

SMD head

HM: high-speed placement head; FM: flexible multi-function placement head

Patch score

HM: 10; FM: 5

Placement accuracy

±0.035mm(±0.025mm)Cpk≥1.0(3σ)

Placement speed

95,000CPH (two sets of placement heads, under optimal conditions)

Mounted component range

HM: 0201 ~ W55 × L100mm, height 15mm or less
 
※ Regarding the placement of 0201 components, please consult separately.

 

FM: 03015 ~ 55mm L100mm, height within 28mm

PCB size

When transferring one substrate: L810 × W490 to L50 × W50
 
When transferring 2 substrates: L380 × W490 ~ L50 × W50

Maximum number of feeders loaded

Fixed feeder rack: up to 140 (converted based on 8mm tape)
 
Disposable material changing cart: up to 128 pieces (converted based on 8mm material tape)
 
Automatic pallet feeder: 30 layers (fixed type: maximum when sATS30 is installed), 10 layers (cart type: maximum when cATS10 is installed)

power supply

3-phase AC 200/208/220/240/380/400/416V±10% 50/60Hz

air pressure

0.45Mpa or above, clean, clean

Appearance size

L1,374 x W1,843 x H1,445mm

weight

Approx. 1,800kg

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