YSM20R(PV)

High efficiency modular placement machine

Single-head solution: Flexible and high-speed, both small components and large wafers can be processed without changing heads, and the production line combination is suitable for both long and short lengths.
Ultra-high-speed placement capability: 95,000 CPH (Note: Tested under YAMAHA’s optimized conditions).
The flexible placement head can be optionally configured to meet customers' needs for high efficiency and low-cost production.
The touch screen mode makes operation more convenient and efficient.
The high-speed intelligent recognition function makes programming and component parameter setting faster.

SMD head	HM: high-speed placement head; FM: flexible multi-function placement head
Patch score	HM: 10; FM: 5
Placement accuracy	±0.035mm(±0.025mm)Cpk≥1.0(3σ)
Placement speed	95,000CPH (two sets of placement heads, under optimal conditions)
Mounted component range	HM: 0201 ~ W55 × L100mm, height 15mm or less ※ Regarding the placement of 0201 components, please consult separately.
	FM: 03015 ~ 55mm L100mm, height within 28mm
PCB size	When transferring one substrate: L810 × W490 to L50 × W50 When transferring 2 substrates: L380 × W490 ~ L50 × W50
Maximum number of feeders loaded	Fixed feeder rack: up to 140 (converted based on 8mm tape) Disposable material changing cart: up to 128 pieces (converted based on 8mm material tape) Automatic pallet feeder: 30 layers (fixed type: maximum when sATS30 is installed), 10 layers (cart type: maximum when cATS10 is installed)
power supply	3-phase AC 200/208/220/240/380/400/416V±10% 50/60Hz
air pressure	0.45Mpa or above, clean, clean
Appearance size	L1,374 x W1,843 x H1,445mm
weight	Approx. 1,800kg

YC8 S10 S20 Σ-G5SⅡ Σ-F8S YSM40R YSM20WR YRM20