S10
S10
S10

S10

3D hybrid module placement machine

Key Features

  • Extensible to mount 3D MID
  • Strengthen substrate response capabilities
  • Flexible component/variety response capabilities
  • Extremely versatile switch ability

Specifications

Support PCB size

L50xW30~L1,330xW510mm

SMD component range

0201~120x90mm, BGA, CSP, connectors, other heterosexual parts

Placement speed

45,000CPH (in best condition)

Placement accuracy

±0.025mm (3σ)

Maximum number of loaded feeders

             90(converted based on 8mm tape)

air pressure

0.45Mpa or above

Dimensions

L1,250xD1,750xH1,420mm

weight

1,200Kg

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